首页|填充型有机硅基导热凝胶的制备和性能研究

填充型有机硅基导热凝胶的制备和性能研究

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以有机硅基热界面材料为研究对象,使用不同黏度配比的硅油作为基体,并以氧化铝和氧化锌作为导热填料,制备了一系列填充型有机硅导热凝胶样品.分别研究了凝胶成分对材料力学性能、导热性能以及点胶性能等的影响.研究结果表明:所制备的有机硅导热凝胶的热导率主要受导热填料的影响,当高黏度乙烯基硅油占比为50%时,导热凝胶的各项性能良好,拉伸强度、断裂伸长率、邵氏硬度、热导率和挤出率分别达到0.37 MPa、184%、63.42、2.90 W/(m·K)和106.4 g/min.此外,本研究的导热凝胶样品在应对高温高湿环境和冷热循环试验表现良好,能满足行业要求,具备良好的应用前景和应用价值.
Preparation and properties of filled silicone-based thermal conductive gel
Taking silicone-based thermal interface materials as the research object,a series of filled silicone thermal conductive gel samples were prepared by using silicone oil with different viscosity ratios as the matrix,and alumina and zinc oxide as the thermal conductive fillers.The effects of gel composition on the mechanical properties,thermal conductivity,dispensing properties of the materials were investigated,respectively.The research results showed that the thermal conductivity of the prepared silicone thermal conductive gel was mainly affected by the thermal conductive filler.When the proportion of high-viscosity vinyl silicone oil was 50%,the thermal conductive gel had good properties,with the tensile strength,elongation at break,Shore hardness,thermal conductivity and extrusion rate reaching 0.37 MPa,184%,63.42,2.90 W/(m·K)and 106.4 g/min,respectively.In addition,the thermal conductive gel samples in this study performed well in high temperature and high humidity environments and in hot and cold cycle tests,which could meet the requirements of the industry and have good application prospects and application values.

thermal interface materialssilicone gelthermal conductivityorganic silicone

尚田雨、张晨旭、任琳琳、曾小亮、孙蓉

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深圳先进电子材料国际创新研究院,广东深圳 518100

热界面材料 硅凝胶 热导率 有机硅

科技部国家重点研发计划广东省基础与应用基础研究计划中国科学院青年创新促进会项目广东省重点实验室项目深圳市科技研究基金项目

2022YFA12031002020B01019000420193542014B030301014JCYJ20200109114401708

2024

中国胶粘剂
上海市合成树脂研究所 全国粘合剂信息站 中国胶粘剂和胶粘带工业协会

中国胶粘剂

CSTPCD
影响因子:0.522
ISSN:1004-2849
年,卷(期):2024.33(1)
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