Study on curing of modified acrylate adhesive for FPC
When modified acrylate adhesive was applied to flexible printed circuit board(FPC)and its substrates,the degree of curing had a decisive influence on the performance.In this paper,taking the self-made epoxy resin modified acrylate adhesive as an example,the kinetic behavior of its non-isothermal curing was analyzed theoretically by dynamic differential scanning calorimetry(DSC),in order to study its storage stability at room temperature and the process conditions of high temperature curing.Then,its curing reaction process at room temperature and the temperature range of 125-300 ℃ was investigated by Fourier transform infrared spectroscopy(FT-IR)to ensure the curing performance or effect of the adhesive applied to the thermosetting adhesive film/sheet of FPC.The research results show that,(1)The curing kinetics equation of the modified acrylate adhesive was determined by non-isothermal DSC test,from which it was deduced that its reaction rate constant K value was as low as the 10-5 min-1 level and below under the conventional storage temperature of 10-50 ℃,exhibiting excellent B-order stability.At the same time,the K value at 180 ℃ and above reached the 10-1 min-1 level,which could meet the requirements of rapid curing by high temperature baking.(2)Based on three characteristic temperatures obtained from the dynamic DSC test,the theoretical curing temperature of this adhesive film was calculated to be 182℃,and it took about 100 min to realize 100％curing at this temperature,which was verified by DSC test.(3)The reaction process of the above high temperature curing was verified by FT-IR comparison,and the epoxy group was basically reacted completely after treatment at 200 ℃,which was consistent with the results of the above analysis.
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