Preparation and reliability study of single-component addition-type thermal conductive silica gel
Two kinds of single-component addition-type thermal conductive silica gel(UB-5705 and UB-5707)were prepared by using low to medium viscosity vinyl silicone oil,hydrogen containing silicone oil combined with micron alumina thermal conductive powder as raw materials.The obtained products were clarified by infrared spectrometer analysis,and further characterized by differential scanning calorimeter,thermogravimetric analyzer and thermal conductivity tester.High temperature and high humidity,hot and cold cycling,and high temperature aging reliability studies were also carried out.The research results showed that,(1)The synthesis of thermal conductive silica gel was effective and met the test expectations.The thermal cracking temperature(Td)was greater than 250 ℃,the thermal conductivity coefficient was greater than 1.90 W/(m·K),the thermal resistance was lower than 10.184 ℃·cm2/W,and the shear strength was more than 5.00 MPa.(2)In contrast,UB-5705 had superior toughness,while UB-5707 had a higher thermal conductivity.(3)After 1 000 h of high temperature and high humidity,cold and hot cycling and high temperature aging,respectively,two kinds of thermal conductive silica gel still maintained high thermal conductivity and mechanical properties,with thermal conductivity＞1.80 W/(m·K),shear/tensile strength＞4.0 MPa,the elongation at break＞20％.The comprehensive performance met the requirements for reliability of chip and radiator assembly.
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