With the rapid popularization of consumer electronic products and the continuous progress of technology,the thermal conductive adhesive market demand continues to increase,and the development potential is huge.However,while miniaturization,integration,and portability of electronic products are rapidly developing,higher requirements are also put forward for the thermal conductivity of thermal conductive adhesive.Therefore,in this article,the thermal conductivity mechanism of filled thermal conductive adhesive was introduced,the application scope of traditional thermal conductivity models,and the method of finite element simulation to predict the thermal conductivity coefficient were discussed.The research achievements of thermal conductive adhesive colloids in recent years were reviewed,and the type,shape,particle size,modification of thermal conductive adhesive fillers,as well as the influence of the mixed use of thermal conductive fillers on the thermal conductivity coefficient of thermal conductive adhesive were described emphatically,and the methods for improving the thermal conductivity coefficient of thermal conductive adhesive were summarized.
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