Synthesis and performance study of dimethyl p-xylylene cyanate
Dimethyl p-xylylene phenol(DMPXPh)was synthesized by using p-phenyldimethyl ether as the raw material,and a new type of dimethyl p-xylylene cyanate(DMPXCy)was prepared by the cyanogen chloride-phenol method,and the structure was measured.The thermal properties,moisture and heat resistance,dielectric properties,and mechanical properties of the material were investigated,and compared with bisphenol A cyanate(BADCy).The research results showed that,(1)The characterization by infrared and nuclear magnetic resonance spectroscopy confirmed that the target phenolic intermediate was successfully prepared,and the phenolic intermediate was synthesized into cyanate monomer through cyanate esterification.(2)The study on the curing behavior and thermal performance of DMPXCy showed that the reaction activity of DMPXCy was lower than that of BADCy resin,and the addition of organic metal catalysts significantly reduced the curing temperature,allowing for stepwise curing within 280 ℃.In addition,the glass transition temperature of DMPXCy resin was lower than that of BADCy resin,and its thermal stability was basically the same.However,the residual carbon rate of DMPXCy was higher,indicating a certain degree of ablation resistance.(3)The research on mechanical properties showed that the overall mechanical strength of DMPXCy resin was similar to that of BADCy,with slightly lower tensile strength.(4)The research on the moisture absorption and dielectric properties of DMPXCy resin showed that DMPXCy resin exhibited excellent dielectric properties and low moisture absorption,the dielectric constant(ε)and dielectric loss tangent(tanδ)were 2.650 and 0.004 50,respectively,the saturation moisture absorption rate was 0.70％,which were much lower than the dielectric loss and moisture absorption rate of BADCy resin.DMPXCy resin had good application potential as a resin matrix for low dielectric transparent materials or high-precision aerospace composite materials and adhesive.
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