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丙烯酸酯基导电压敏胶研究进展

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综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料.对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶.最后对丙烯酸酯基导电压敏胶未来发展进行了展望.
Research progress in acrylate-based conductive pressure sensitive adhesive
The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed.The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized.Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.

conductive pressure sensitive adhesiveacrylateconductive filler

徐丹、张军营、牛栋华、宋佳赟、刘彤、程珏

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北京天宇航天新材料科技有限公司,北京 101407

北京化工大学材料科学与工程学院,北京 100020

导电压敏胶 丙烯酸酯 导电填料

2024

中国胶粘剂
上海市合成树脂研究所 全国粘合剂信息站 中国胶粘剂和胶粘带工业协会

中国胶粘剂

CSTPCD
影响因子:0.522
ISSN:1004-2849
年,卷(期):2024.33(4)
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