丙烯酸酯基导电压敏胶研究进展
Research progress in acrylate-based conductive pressure sensitive adhesive
徐丹 1张军营 2牛栋华 1宋佳赟 1刘彤 1程珏2
作者信息
- 1. 北京天宇航天新材料科技有限公司,北京 101407
- 2. 北京化工大学材料科学与工程学院,北京 100020
- 折叠
摘要
综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料.对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶.最后对丙烯酸酯基导电压敏胶未来发展进行了展望.
Abstract
The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed.The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized.Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.
关键词
导电压敏胶/丙烯酸酯/导电填料Key words
conductive pressure sensitive adhesive/acrylate/conductive filler引用本文复制引用
出版年
2024
NETL
NSTL
万方数据