Study on curing process of one-component paste adhesive with high-temperature resistance
One-component paste adhesive J-481 with high-temperature resistance was taken as the research object,the exothermic curve of adhesive J-481 was detected by using differential scanning calorimeter.The viscosity-temperature curve of adhesive sample and the viscosity-time characteristics under different heating processes were investigated by using rheometer.The bonding strength of the adhesive sample under different curing processes and the physical state of the adhesive with different adhesive layer thicknesses after curing under different curing processes were analyzed.The research results showed that,the viscosity,curing degree,and bonding performance of adhesive J-481were significantly affected by the curing mechanism.Excessive heating caused rapid viscosity growth,heat accumulation caused explosive aggregation and ablation of thick adhesive layer samples,and insufficient curing temperature led to a decrease in bonding strength.By using a gradient heating and curing method of 120℃/3 h+180℃/1 h,all samples with the thickness of 0.3～5 mm could be cured normally without any explosive aggregation or ablation phenomenon,which was more suitable for practical applications.Comparing the curing degree and bonding strength of different substrates under two curing conditions of 120℃/3 h+180℃/1 h and 180℃/3 h,it was found that using the gradient heating and curing mechanism of 120℃/3 h+180℃/1 h could ensure excellent and stable bonding performance of adhesive J-481 for bonding different substrates.
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