Progress of epoxy resin AB adhesive for LED encapsulation
In this paper,the development process of epoxy resin AB adhesive for LED encapsulation in China,from the initial application of liquid bisphenol A epoxy resin to cycloaliphatic epoxy resin,and recently the application of silicone hybrid cycloaliphatic epoxy resin was introduced.The formulation,performance,and research progress of epoxy resin adhesive for direct-insertion LED and digital tube encapsulation,epoxy resin AB adhesive for SMD RGB encapsulation,and epoxy resin AB adhesive for Mini LED encapsulation(such as compound amine cured epoxy resin AB adhesive,epoxy resin AB adhesive for matte display screen encapsulation,heat cation-cured epoxy resin AB adhesive,and anhydride-cured silicone hybrid cycloaliphatic epoxy resin AB adhesive,etc.)both domestically and internationally were shared in details.The development requirements and trends of future new epoxy resins were also discussed.
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