Preparation and properties of single component epoxy adhesive for electronic component bonding
The single component medium & low-temperature curing epoxy adhesive was prepared for electronic component bonding.The effects of different types of epoxy resins,fillers,and curing accelerators on their tensile shear strength,tensile strength,elongation at break,and curing properties were mainly studied.The research results showed that the single component epoxy adhesive prepared based on bisphenol F-type epoxy resin exhibited better bonding strength and lower hardness compared to bisphenol A-type and polyurethane modified epoxy resin.When used in combination with calcium carbonate,the tensile shear strength was significantly improved compared to silicon micro powder and kaolin,and the elongation at break reached about 55％,indicating a certain degree of elasticity.Using the same amount of accelerator,the curing promotion rate was in the order of modified urea accelerator＞modified amine accelerator＞imidazole accelerator.The developed single component epoxy adhesive product could be stored normally for 3 weeks at room temperature,was easy to use,had good curing efficiency and excellent mechanical properties,which could be applied to the structural bonding of electronic components.
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