Research progress of polyimide-based high-temperature resistant adhesive
Polyimide adhesive has outstanding high-temperature resistance,dimensional stability,physical and chemical stability,dielectric properties,and bonding properties,making it a type of adhesive with excellent comprehensive performance,and therefore receiving increasing attention.In this paper,the research progress of classic(thermoplastic,thermosetting)polyimide adhesive,polyimide adhesive with molecular structure modification(molecular main chain structure modification,end group structure modification),and blend modified polyimide adhesive from the perspective of molecular structure was mainly reviewed,and the future development trend of polyimide adhesive was prospected.
万方数据
维普
