摘要
环氧树脂在电子领域有着广泛的应用,在环氧树脂中引入有机硅的Si—O—Si可改善环氧树脂脆而硬、耐候性差的缺点.本文综述了无溶剂有机硅改性环氧电子胶的改性方法、表征手段,介绍了目前国内外有机硅改性环氧树脂的一些研究进展和在电子领域(如灌封胶、LED密封胶、导电胶等)的应用,并展望了有机硅改性环氧树脂的未来发展方向.
Abstract
Epoxy resin has a wide range of applications in the field of electronics.Introducing silicone-based Si—O—Si into epoxy resin can improve its brittleness,hardness,and poor weather resistance.In this article,the modification methods and characterization methods of solventless silicone-modified epoxy electronic adhesive were reviewed,some research progress of silicone-modified epoxy resins at home and abroad,and their applications in the electronic field(such as potting adhesive,LED sealant,conductive adhesive,etc.)were introduced,and the future development direction of silicone-modified epoxy resin was prospected.
维普
万方数据