Evaluation of the reliability application of a high thermal conductivity insulating adhesive in the satellite-borne terminal machine
In response to the reliability application requirements of high thermal conductivity insulating underfill adhesive for satellite-borne terminal machine,a comprehensive impact assessment on the reliability and environmental adaptability of two-component high thermal conductivity insulating adhesive was conducted.The intrinsic performance indicators and processability indicators were tested and verified through standard samples of thermal conductivity insulating adhesive performance testing,and their qualifications were analyzed and evaluated as well.Typical BGA daisy-chain network structure samples were designed and produced,and by using thermal conductive adhesive filling technology,the effect of void ratio of thermal conductivity insulating adhesive on BGA device solder joints was verified and its process adaptability was also evaluated.Satellite-borne terminal loading was designed and manufactured,and acceptance-level environmental and reliability tests on satellite-borne products were conducted,in order to verify that the terminal loading had the ability to withstand working and environmental stresses.This high thermal conductivity insulating adhesive met the requirements of heat dissipation and high load resistance for satellite-borne products,achieving reliable applications.
high thermal conductivity insulating adhesivedaisy-chainsolder jointvoid rateenvironmental testreliability
万方数据
维普
