Development of a new solvent-free,colorless and transparent epoxy adhesive
A new solvent-free,colorless and transparent epoxy adhesive was prepared by using hydrogenated bisphenol A epoxy resin and epoxy resin as the main components,and adjusting the ratio of hydrogenated bisphenol A epoxy resin,epoxy resin,and toughening agent.The viscosity,gelation time,electrical properties,impact strength,tensile shear strength,water absorption,curing reaction kinetics and UV-visible light transmittance of the epoxy adhesive system were systematically studied.The research results showed that,the prepared epoxy adhesive did not require the addition of solvents and had excellent reactivity,dielectric properties,water absorption,cold resistance and toughness.It also had excellent transparency and light transmittance,making it suitable for application in the field of optical instruments.
hydrogenated bisphenol A epoxy resinepoxy resinepoxy toughening agentcold resistancetoughnesslight transmittance
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维普
