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创新链视角下的中美科技关联研究

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本研究从创新链的视角出发,对中美整体和半导体领域的科技关联情况进行分析研究.将创新链划分为科学、技术和产业3个维度,将论文、专利和贸易作为每一维度的表征,构建中美科技关联指标体系,在此基础上形成中美科技关联指数模型.依据所构建的指数模型,分析了 21世纪以来中美整体和半导体领域的科技关联情况和变化趋势,研究了创新链不同环节中美关联的变化规律与特点.数据显示,从整体上看中美已经出现了科学和产业关联减弱的趋势;在半导体领域同样出现了科学和技术关联下降的情况,但未来中美科技关联的实际走向还需要更长时间的观察与研究.
The Study on U.S.-China Science and Technology Linkages from the Perspective of Innovation Chain
This study researches the science and technology linkages between China and the United States as a whole and in the field of semiconductor from the perspective of the innovation chain.This paper divides the innovation chain into three dimensions of science,technology and industry,and takes papers,patents and trade as the characterization of each dimension to construct a index system,and on this bases,forms the U.S.-China science and technology linkage model.Based on the index model,this paper analyzes the sit-uation and changing trend of science and technology linkages between China and the United States as a whole and in the semiconductor field since the beginning of this century,and studies the changing patterns and characteristics of U.S.-China linkages in different links of the innovation chain.The data show that,on the whole,there has been a trend of weakening scientific and industrial connections be-tween China and the United States.In the semiconductor field,there has also been a decline in science and technology linkages.But the actual trend of U.S.-China science and technology linkages in the future needs a longer period of observation and research.

U.S.-China technology linkageU.S.-China technology competitionCo-authorshipCooperative patentInternational trade

张艾黎、程如烟、姜桂兴

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中国科学技术信息研究所,北京 100038

中美科技关联 中美科技竞争 合著论文 合作专利 国际贸易

中国科学技术信息研究所创新研究基金青年项目

QN2023-05

2024

中国科技论坛
中国科学技术发展战略研究院

中国科技论坛

CSTPCDCSSCICHSSCD北大核心
影响因子:1.081
ISSN:1002-6711
年,卷(期):2024.(6)