首页|面向微电磁线圈制备的硅表面电流体喷印行为研究

面向微电磁线圈制备的硅表面电流体喷印行为研究

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针对硅衬底上的电流体喷印行为,探究了喷印参数与衬底属性对喷印过程及结果的影响,优化了喷印参数,并成功在硅衬底上制备了平面电磁线圈.研究结果表明:喷印参数对动力锥射流的形成及最终图案形貌具有显著影响;偏置电压影响墨滴累积量,幅值电压影响射流稳定性,喷印高度影响电场力,而喷印频率和占空比则影响沉积效率和线宽;衬底表面浸润性对墨水沉积线宽具有显著影响,线宽随接触角的降低而减小.此外,针对方形线圈转角处易出现的墨水堆积问题,提出了喷印路径的优化方案,即对方向线圈转角处进行圆角处理,有效提升了线圈结构的一致性.最终,基于上述研究在硅表面制备了形貌均匀、一致性良好的电磁感应线圈,该线圈在mT级磁场测试中展现出良好的线性度.
Study on the behavior of electrohydrodynamic jet printing on silicon surfaces for micro-electromagnetic coil fabrication
The influences of printing parameters and substrate properties on the printing process and results of electrohydrodynamic jet printing behavior on silicon substrates were studied.The printing parameters were optimized,and planar electromagnetic coils were successfully prepared on silicon substrates.The results indicates that printing parameters significantly impact the formation of the dynamic cone jet and the final pattern morphology.The magnitude of the bias voltage affects the accumulated ink volume,while the amplitude voltage influences jet stability.Printing height affects the electric field force,and printing frequency and duty cycle influence deposition efficiency and line width.Additionally,the substrate surface wettability has a significant impact on the deposited ink line width,while the line width decreases with the lowered contact angle.Furthermore,to address the ink accumulation issue often encountered at the corners of square coils,this article proposes an optimization scheme for the printing path,specifically apply-ing fillet processing to the corners of the square coils.This effectively improves the consistency of the coil structure.Finally,based on the aforementioned research,electromagnetic induction coils with uniform morphology and good consistency are fabricated on the silicon surface which exhibits excellent linearity in mT-level magnetic field tests.

electrohydrodynamic jet printingelectromagnetic induction coilssingle-crystal siliconprinting behavior

甘寅锴、邹龙雨、王剑亮、余丙军

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西南交通大学机械工程学院,成都 610031

电流体喷印 电磁感应线圈 单晶硅 喷印行为

2024

中国科技论文
教育部科技发展中心

中国科技论文

影响因子:0.466
ISSN:2095-2783
年,卷(期):2024.19(10)