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有机神经形态机器视觉器件及系统

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随着有机半导体材料及其器件的快速发展,有机电子学在可穿戴设备、人工智能等发面取得快速发展.有机半导体材料具有成本低、生物相容性好、光谱响应可调、柔性度好等优势,在光电器件等新兴智能感知领域显示出巨大的商业应用潜力,同时也是制造柔性仿生视觉传感器不可或缺的组成部分.本文从有机光电材料分类及用于视觉仿生感知的光电器件层面重点介绍了近年来人工神经形态视觉智能传感系统的研究进展,包括应用较多的视觉触觉多感集成系统.最后阐述了发展有机仿生视觉系统的重要意义与现存挑战以及展望,为将来有机视觉感知应用及多感集成提供可行的研究方向.
Organic neuromorphic machine vision devices and systems
In recent years,organic electronics has surged forward,fueled by the rapid advancement of organic semiconductor materials and their devices.This progress holds immense promise for innovative applications in fields like wearable electronics and artificial intelligence.Organic semiconductors shine with several benefits:their low cost,excellent biocompatibility,tunable spectral response,and impressive flexibility.These attributes unlock significant commercial potential,particularly in emerging intelligent sensing fields like optoelectronic devices.In the realm of flexible biomimetic vision sensors,they are an indispensable building block.This paper delves into the research advancements shaping artificial neural form visual intelligent sensing systems.We explore the categories of organic photoelectric materials and photoelectric devices crucial for biomimicry in visual sensing,culminating in the discussion of integrated multi-sensory systems encompassing both vision and touch.Finally,we analyze the significance and current challenges of developing organic bionic vision systems,offering feasible research directions for harnessing the power of organic visual perception and multi-sensory integration in the future.

organic materialsphotoelectric synapsesbionic applicationsmulti-sensory fusionintelligent perception

胡嘉慧、江明浩、周晔、文心洁、翟永彪、吕子玉、韩素婷

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深圳大学电子与信息工程学院,深圳 518060

深圳大学高等研究院,深圳 518060

香港理工大学应用生物及化学科技系,香港 999077

有机材料 光电突触 仿生应用 多感融合 智能感知

国家自然科学基金国家自然科学基金国家自然科学基金广东省自然科学基金广东省自然科学基金深圳市基础研究专项深圳市基础研究专项深圳市基础研究专项

6212205552373248621041542021A15150125692021A1515012588JCYJ20210324095207020JCYJ20220531102214032JCYJ20230808105900001

2024

中国科学(化学)
中国科学院

中国科学(化学)

CSTPCD北大核心
影响因子:0.685
ISSN:1674-7224
年,卷(期):2024.54(4)
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