We propose a novel minichannel heat dissipation approach using a liquid metal for the thermal management of electronic devices with high heat flux density.A compact induction electromagnetic pump with a flow rate of 4.55 L/min and a driving pressure head of 64.2 kPa was developed.Moreover,a liquid metal thermal control platform was constructed based on high heat flux electromagnetic drive to meet the heat dissipation requirements with a high heat flux density of 249 W/cm2.A simulation model for optimizing three-dimensional fluid-solid coupling multiparameters was designed,and the validity of numerical simulation was verified experimentally.The results reveal that the thermal resistance of the liquid metal heat capacity at a low flow rate is the main factor affecting its heat dissipation(accounting for approximately 23.6％of the total thermal resistance),and its surface temperature uniformity can be enhanced by optimizing the relative position of the heat source.
维普
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