首页|木薯淀粉与交联甜菜果胶复配体系的静电和氢键相互作用研究

木薯淀粉与交联甜菜果胶复配体系的静电和氢键相互作用研究

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在木薯淀粉(TS)和交联甜菜果胶(CSBP)复配体系(TCS)中分别添加氯化钠和尿素,考察了静电和氢键相互作用对复配体系糊化、流变和微观结构等的影响。结果表明:随着氯化钠添加量的增加,TCS复配体系的黏度值呈现逐渐降低的趋势,而添加尿素后峰值黏度未发生显著变化。添加氯化钠和尿素均可显著降低复配体系的膨胀势,而透光率在添加氯化钠后降低,添加尿素后升高。粒径分析表明,复配体系的D50随着氯化钠的添加从191。15μm逐渐降低到166。29 μm,而添加尿素后未发生显著变化。复配体系的稠度指数K、储能模量G'和损耗模量G"均随着氯化钠和尿素添加量的增加呈逐渐降低的趋势。此外,扫描电镜结果表明,氯化钠和尿素的加入均可使复配体系凝胶结构坍塌,孔径变得不均匀。静电相互作用是TS和CSBP之间的主要作用力。
Electrostatic and Hydrogen Bond Interactions Between Tapioca Starch and Cross-linked Sugar Beet Pectin
Sodium chloride and urea were added to the tapioca starch(TS)and cross-linked sugar beet pectin(CSBP)blends(TCS),and the effects of electrostatic and hydrogen bond interactions on the gelatinization,rheology and microstructure of the blends were determined.The results indicated that with the increase of sodium chloride,the viscosity of the TCS blends gradually decreased,while the peak viscosity of the blends did not change significantly af-ter urea was added.The swelling power of the blends decreased remarkably after sodium chloride and urea were add-ed,while the light transmittance decreased after sodium chloride was added and increased after urea was added.The particle size analysis indicated that the particle size of the blends decreased from 191.15 μm to 166.29 μm with the addition of sodium chloride,however,it did not change significantly after the addition of urea.The consistency index K,storage modulus G'and loss modulus G"of the blends all gradually decreased with the increase of sodium chloride and urea.Further,the SEM results indicated that the addition of sodium chloride and urea could cause the structure of the blends to collapse and the pore diameter to uneven.The electrostatic interaction was the main force between TS and CSBP.

cross-linked sugar beet pectintapioca starchNaClureainteraction

闫璟圆、冯嘉庆、王子成、黄琳茜、王晓乐、徐磊

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淮阴工学院生命科学与食品工程学院,淮安 223003

交联甜菜果胶 木薯淀粉 氯化钠 尿素 相互作用

国家自然科学基金青年科学基金江苏省大学生创新创业训练计划江苏省大学生创新创业训练计划

31801581202211049091Y202211049427YJ

2024

中国粮油学报
中国粮油学会

中国粮油学报

CSTPCD北大核心
影响因子:1.056
ISSN:1003-0174
年,卷(期):2024.39(3)
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