中国软科学2024,Issue(11) :161-171.

"技术突破创新"与"智造转型"何以兼得:基于京东方复杂产品系统的纵向案例研究

How to achieve"technological breakthrough and innovation"and"intelligent manufacturing transformation":A longitudinal case study based on BOE's complex product system

赵林汐 邵云飞 陈燕萍 王思梦
中国软科学2024,Issue(11) :161-171.

"技术突破创新"与"智造转型"何以兼得:基于京东方复杂产品系统的纵向案例研究

How to achieve"technological breakthrough and innovation"and"intelligent manufacturing transformation":A longitudinal case study based on BOE's complex product system

赵林汐 1邵云飞 1陈燕萍 1王思梦1
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作者信息

  • 1. 电子科技大学经济与管理学院,四川 成都 611731
  • 折叠

摘要

我国复杂产品系统技术突破创新取得长足进展,却常受制于智造转型不足带来的问题.对京东方半导体生产线复杂产品系统进行探索性案例分析,发现数字化制造贯穿转型全过程,网络化制造后期以平台赋能为主,与智能化制造融合较深,智造转型与技术突破创新呈现长期动态耦合状态.

Abstract

China has made significant progress in technological breakthroughs and innovation in complex product systems,yet it is often hindered by issues arising from insufficient intelligent manufacturing transformation. This paper conducts an exploratory case analysis of the complex product system in BOE 's semiconductor production line and finds digital manufacturing permeates the entire transformation process. In the later stages of networked manufacturing,platform empowerment becomes the main focus,deeply integrating with intelligent manufacturing. The transformation towards intelligent manufacturing is in a long-term dynamic coupling state with technological breakthroughs and innovation.

关键词

智能制造/复杂产品系统/动态能力理论/半导体生产线/技术发展路径

Key words

intelligent manufacturing/complex product system/dynamic capability theory/semiconductor production line/the developing path of technology

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出版年

2024
中国软科学
中国软科学研究会

中国软科学

CSTPCDCSSCICSCDCHSSCD北大核心
影响因子:2.793
ISSN:1002-9753
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