Research progress in thermally conductive composite films based on filled polymers
With the rapid development and application of flexible electronic devices,traditional thermal management mate-rials cannot meet a requirement of application for high thermal conductance,high toughness,and good mechanical adapt-ability.Thermally conductive flexible thin film materials with high a thermal conductivity exhibit great potential in ther-mal management applications for next-generation devices and therefore have attracted great attention by many research-ers.At present,thermally conductive thin film materials have shown great application potential in smartphones,ultra-thin notebooks,flexible wearables,and smart home appliances.This paper introduced the classification of filled polymer-based thermal conductive composite films and their thermal conduction mechanisms from the aspects of the improvement in their thermal conductivity.The thermal conductivity of the composite films was improved by designing fillers to con-struct a low thermal resistance and high thermal conductivity path as well as a three-dimensional thermal conduction net-work.The research progress in the filled polymer-based thermal conductive composite films was also reviewed.
heat conductionpolymer-based thermally conductive filmpacking designbuild a three-dimensional network
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