Experimental Study on Rapid Microwave Surface Mounting Technology for Flexible Circuits
Hybrid flexible electronics with integrated circuit components mounted on flexible sub-strates have wide application prospects and commercialization potential.However,most of the flexible cir-cuits are not resistant to high temperature,and it is a great challenge to mount the electronic components on temperature sensitive flexible substrates firmly and rapidly without damaging the substrate,which re-strains the development of the hybrid flexible electronics.Microwave magnetic field is utilized to realize rapid and efficient component surface-mounting on flexible circuits,because it can quickly and selectively heat metallic powders.In a TE102 single mode cavity experiment,chip resistors and patch light emitting diodes(LEDs)are quickly mounted on polyimide flexible substrate,verifying the feasibility of microwave fast and efficient surface mounting.By comparing the microstructure of solder joints treated by microwave heating and by traditional heating,it is found that the former has thinner intermetallic compound thick-ness,which can improve the strength of solder joint.The proposed microwave magnetic field surface mounting technology provides a solution for the rapid and large-scale mounting of surface components in flexible circuits,which is conducive to promoting the development and commercialization of flexible cir-cuits.
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