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碳化硅真空纳米电子器件技术分析

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新兴的真空纳米电子器件兼具固态器件集成电路和传统真空电子器件的优势.但和硅器件同工艺、同片集成的现状,限制了其在恶劣环境的应用.使用宽禁带半导体碳化硅材料制备真空纳米电子器件,可在耐辐射基础上兼具抗高温特性,使该器件具备良好的综合优势.文章分析了硅器件及集成电路发展中面临的问题,回顾了真空纳米电子器件的发展历史,介绍了碳化硅材料的相对优势以及SiC基真空纳米电子器件研究现状,并对该器件发展及应用前景进行了分析.
Technological Analysis of Silicon Carbide Based Vacuum Nanoscale Electronic Devices
Emerging vacuum nanoscale electronic devices combine the advantages of solid-state device integrated circuits and traditional vacuum electronic devices.However,the same process and integration platform with silicon devices limits their wider application in harsh environment.The use of wide bandgap semiconductor material silicon carbide in the preparation of vacuum nanoscale electronic devices can provide both radiation resistance and high temperature resistance,giving the device excellent comprehensive advan-tages.The problems faced in the development of silicon devices and integrated circuits are analyzed,the development history of vacuum nanoscale electronic devices is reviewed,the relative advantages of silicon carbide materials and the current research status of silicon carbide based vacuum nanoscale electronic de-vices are introduced,and the development and application prospects of the devices are analyzed.

Silicon carbideVacuum devicesNanoscale devicesTemperature resistanceRadiation resistance

任大鹏、李兴辉、韩攀阳、仲子琪

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中国电子科技南湖研究院,浙江嘉兴 314000

上海交通大学电子信息与电气工程学院,上海 200240

中国电子科技集团公司第十二研究所微波电真空器件国家级重点实验室,北京 100015

碳化硅 真空器件 纳米器件 抗温 抗辐射

2024

真空电子技术
北京真空电子技术研究所

真空电子技术

影响因子:0.166
ISSN:1002-8935
年,卷(期):2024.(3)
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