Reliability Study of the Domestic Silicon Nitride Active Metal Brazing Copper Ceramic Substrate
The excellent reliability of silicon nitride-copper ceramic substrate makes it one of the essen-tial heat dissipation substrate materials for power modules in fields such as new energy vehicles and high-speed railways.The active metal brazing process is used to manufacture domestic silicon nitride-copper ce-ramic substrate.The peel strength of the substrate is≥14 N/mm,and the overall peel strength perform-ance is uniform.After being subjected to high and low temperature shocks at 300℃-25℃for 120 cycles,no significant delamination is observed,and the peel strength does not show a significant decrease.The domestic silicon nitride active metal brazing copper ceramic substrate shows an S-shaped bend at the frac-ture point during the pull-out test,and the copper layer doesn't show any copper layer delamination.The domestic silicon nitride active metal brazing copper ceramic substrate is comparable to imported products and can meet the requirements of power module usage.
Silicon nitrideActive metal brazingPeel strengthThermal cycle
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