Research Progress on Large-area Diamond Wafer Replication Technology
The development of semiconductor technology is inseparable from the efficient preparation of large-area wafers.In semiconductor field,wafer replication can be achieved by cutting after homoepitaxial growth or by heteroepitaxy on heterogeneous substrates for mass production.As an ultra-wide bandgap semicon-ductor material,diamond holds promising applications in electronic vacuum devices and high-frequency,high-power solid-state electronic devices.Because of the extremely high hardness of diamond material,wafer replica-tion faces numerous problems.Although the traditional laser cutting method can realize the processing of super-hard diamond,its high processing loss cannot meet the demand for the preparation of large-area wafers.There is an urgent need to develop a diamond wafer replication technology with low loss and high efficiency.Common semiconductor wafer replication technologies are introduced,the research progress and current development level of diamond replication technologies are summarized,and the development direction of large-area diamond wafer replication technology is analyzed and prospected.
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