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变形量对钨铼合金物理性能的影响

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钨铼合金材料具有良好的室温韧性和耐高温性能,在真空电子器件领域有着广泛的应用前景.采用粉末冶金及高温轧制工艺制备了对数应变分别为0.75、1.10、1.47、2.36的钨铼合金板坯,研究了不同变形量下钨铼合金的物理性能的差异.结果表明,随着变形量的增加,钨铼合金的相对密度与维氏硬度都呈现出先快速上升后趋于平缓的趋势.变形量的增加会提高钨铼合金的导热性能.变形量为0时,钨铼合金的室温导热系数约为35 W/(m·K);而对数应变为2.36时,其室温导热系数升至40 W/(m·K).同时钨铼合金的导热性能与温度的变化关系呈现出与纯钨相反的趋势,钨铼合金的导热系数随着温度的升高而增加.
Effect of Deformation on Physical Properties of W-Re Alloys
W-Re alloy has good room-temperature toughness and high-temperature resistance.It has a wide application prospect in vacuum electronic devices.W-Re alloy slabs with logarithmic strains of 0.75,1.10,1.47 and 2.36 are prepared by powder metallurgy and high temperature rolling,and the physical properties of them under differ-ent deformation are studied.The results show that the relative density and Vickers hardness of W-Re alloy increase rapidly at first and then become flat gradually with the increase of deformation.The thermal conductivity of W-Re al-loy increases with the increase of deformation.When the deformation is zero,the thermal conductivity of W-Re alloy at room-temperature is about 35W/(m·K);when the logarithmic strain is 2.36,it increases to 40 W/(m·K).The relationship between the thermal conductivity of W-Re alloy and temperature changes shows an opposite trend to that of pure tungsten,and the thermal conductivity of W-Re alloy increases with the increase of temperature.

W-Re alloyDeformationThermal conductivity

卢业群、任柴、李剑

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成都虹波实业股份有限公司,四川成都 610100

钨铼合金 变形量 导热性能

2024

真空电子技术
北京真空电子技术研究所

真空电子技术

影响因子:0.166
ISSN:1002-8935
年,卷(期):2024.(5)