数据中心光模块技术及演进
Data Center Optical Module Technology and Its Evolution
张平化 1王会涛 1付志明1
作者信息
- 1. 中兴光电子技术有限公司,中国 南京 210012
- 折叠
摘要
算力需求提升带动网络带宽成倍增加,数据中心能耗呈指数型增长.针对低功耗、高带宽的技术需求,硅光、共封装光学(CPO)等技术有望成为长期解决方案.硅光芯片采用光互联,叠加CPO技术,将光引擎与交换芯片共同封装,在速率提高的同时大大缩减功耗.液冷技术、线性驱动可插拨光模块(LPO)、相干技术及薄膜铌酸锂等技术成为光模块优化主要新趋势.LPO在高线性度跨阻放大器(TIA)/驱动芯片厂商大力推动下或可快速落地.相干精简版解决方案在数据中心2 km以内传输距离方面有竞争优势.
Abstract
Network bandwith multiplies and power consumption of data centers increases exponentially.SiPh and co-package optics(CPO)may be long-term solutions around the technical requirements of low-power consumption and high-bandwidth.SiP chips can be optical in-terconnection.Using SiPh and CPO stacking techniques which can realize co-package of optical engines and switch chips,power consump-tion can be greatly reduced when transmission rate inreases.Besides,liquid cooling technology,linear-drive pluggable optics(LPO),coher-ent technology,and thin film lithium niobate will be main development trends of optical modules.LPO should be quick landing with vigorous promotion of high-linearity trans-impedance amplifier(TIA)/driver manufacturers.Coherent lite solution becomes competitive when solving under 2 km transmission in data centers.
关键词
硅光/CPO/LPO/薄膜铌酸锂Key words
SiPh/CPO/LPO/thin film lithium niobate引用本文复制引用
出版年
2024
NETL
NSTL
万方数据