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数据中心光模块技术及演进

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算力需求提升带动网络带宽成倍增加,数据中心能耗呈指数型增长.针对低功耗、高带宽的技术需求,硅光、共封装光学(CPO)等技术有望成为长期解决方案.硅光芯片采用光互联,叠加CPO技术,将光引擎与交换芯片共同封装,在速率提高的同时大大缩减功耗.液冷技术、线性驱动可插拨光模块(LPO)、相干技术及薄膜铌酸锂等技术成为光模块优化主要新趋势.LPO在高线性度跨阻放大器(TIA)/驱动芯片厂商大力推动下或可快速落地.相干精简版解决方案在数据中心2 km以内传输距离方面有竞争优势.
Data Center Optical Module Technology and Its Evolution
Network bandwith multiplies and power consumption of data centers increases exponentially.SiPh and co-package optics(CPO)may be long-term solutions around the technical requirements of low-power consumption and high-bandwidth.SiP chips can be optical in-terconnection.Using SiPh and CPO stacking techniques which can realize co-package of optical engines and switch chips,power consump-tion can be greatly reduced when transmission rate inreases.Besides,liquid cooling technology,linear-drive pluggable optics(LPO),coher-ent technology,and thin film lithium niobate will be main development trends of optical modules.LPO should be quick landing with vigorous promotion of high-linearity trans-impedance amplifier(TIA)/driver manufacturers.Coherent lite solution becomes competitive when solving under 2 km transmission in data centers.

SiPhCPOLPOthin film lithium niobate

张平化、王会涛、付志明

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中兴光电子技术有限公司,中国 南京 210012

硅光 CPO LPO 薄膜铌酸锂

2024

中兴通讯技术
中兴通讯股份有限公司,安徽科学技术情报研究所

中兴通讯技术

CSTPCD北大核心
影响因子:1.272
ISSN:1009-6868
年,卷(期):2024.30(1)
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