As the chip manufacturing process approaches its physical limits,multi-die stacking 3D integrated circuit(IC)technology has emerged as a promising approach to sustain Moore's law.Integrating chips vertically with 3D IC can significantly reduce interconnection length and improve interconnection bandwidth.This paper provides a detailed overview of common 3D IC system architecture solutions and discusses the advantages of using different 3D architectures in terms of performance,power,and area.It also outlines the challenges re-lated to physical implementation,packaging,testing,and process capability.This paper summarizes some typical commercial products that utilize 3D IC technology and introduces their system architecture,typical parameters,applicable fields,and competitiveness improvement.Considering the current industry landscape,the paper suggests that China should comprehensively assess the current situation,capitalize on opportunities,confront challenges without fear,and strive for leadership in this domain.
3D IC3D stack integrated circuit3D system on chipmemory on logiclogic on logic
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