Research on influencing factors of the SiC ceramic thermal conductivity
SiC ceramic is widely used as a kind of high thermal conductivity material.Based on the research progress at home and abroad,this paper discusses the thermal conductivity mechanism and influencing factors of SiC ceramic.It is proposed that impurities,pores and grain boundaries are the main factors affecting the thermal conductivity of SiC ceramic.And reducing impurities,pores and grain boundaries is conducive to improve thermal conductivity.The suggestion for preparing high thermal conductivity SiC ceramic is to increasing the bulk density of SiC ceramic to reduce porosity,increasing the SiC grain size to reduce grain boundaries,reducing the content and types of sintering additives without decreasing the bulk density,ensuring that the sintering additives do not dissolve into the SiC lattice and react with each other to form low thermal conductivity phases with a complex structure,ensuring that the sintering additives are easy to crystallize with little or no residual glass phases,and by adding a second phase with high thermal conductivity.
SiC ceramicthermal conductivityimpurityporegrain boundary
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