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Key engineering materials
Trans Tech Publications Ltd.
Key engineering materials

Trans Tech Publications Ltd.

半月刊

1013-9826

Key engineering materials/Journal Key engineering materials
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    Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer

    H. TakahashiY.B. TianY. MikamiJ. Shimizu...
    P.106-110页
    查看更多>>摘要：Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. However, effect of additive in CMG wheel is not completely understood yet. In this paper, three different CMG wheels were developed, in which one excluded additive and the other two contained two kinds of additive i.e. silicon dioxide and sodium carbonate. Grinding experiments were conducted to explore the influence of exclusion of additive and inclusion of different kinds of additive on CMG performance. The grinding characteristics of the three wheels were also analyzed and discussed to reveal the roles of wheel compositions in CMG process. This work provides some fundamental insights for the selection of different types of additive for optimization of CMG wheel.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    A Study of Wear Characteristics of Superpolished Orthopaedic Implant Materials Using Ultra-precision Polishing

    CHEUNG C.F.LEEW.B.CHARLTON P.TO S....
    P.111-115页
    查看更多>>摘要：Ultra-precision polishing is an emerging technology for producing superfinishing surfaces with sub-micrometer form accuracy and surface finish in nanometer range. It has been applied in superpolishing the freeform bearing surfaces of orthopaedic implants. It is believe that the superfished surfaces are capable of prolonging the life of the implants. In this paper, an experimental investigation of ultra-precision polishing of orthopaedic implants and the study of the wear characteristics of the superfinished surfaces using a multi-directional pin-on-plate wear test simulator have been conducted. Tests were carried out over 3 million cycles using Zeeko IRP200 superfinished cobalt chrome pins articulating against cross-linked UHMWPE plates. The results were compared to that of manually polished pins articulated against the same UHMWPE material. The results show that the Zeeko IRP200 polished pins produced better wear performance that that of the manually polished pins.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    An Experimental Study on Microcutting of Soda-Lime Glass by Milling Process

    Muhammad ArifMustafizur RahmanWong Yoke San
    P.116-120页
    查看更多>>摘要：Glass is an important engineering material. It is widely used in semiconductor, optical, micro-electronics and many other fields. However, glass is not amenable to machining with conventional approach because of its low fracture toughness. To achieve high quality surface finish on optical components, glass must be machined in ductile mode. Compared to single point cutting processes, end-milling can achieve improved material removal rate in machining fracture free surface on brittle material. This paper presents the results of an experimental investigation into microcutting of glass by end-milling. Side-cutting tests have been performed on soda-lime glass workpiece at multiple feeds and radial depth of cuts to obtain fracture free machined surface. The tests were designed to investigate the effect of feed per edge and radial depth of cut on the cutting mechanism at low cutting speed. Experimental results indicate that feed per edge is the most dominant factor that dictates the occurrence of brittle-ductile transition point in the milling process of glass. It has been proved experimentally that fracture free surface can be machined on glass at high radial depth of cut if the feed per edge is sufficiently small.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Investigation of copying rate of tool motions on workpiece profile

    Daisuke KonoAtsushi Matsubara
    P.121-125页
    查看更多>>摘要：The copying characteristic of the tool motion on the workpiece profiles is investigated. Assuming that the workpiece profile consists of sinusoidal-wave components, the amplitude ratio between the workpiece profile and the tool motion is defined as copying rate C_r. An experiment was conducted to identify C_r in shaping of electroless plated nickel. With polycrystalline diamond tools, the copying rate was obtained as C_r =1.16. The result indicates that the amplitude of the workpiece profile can be larger than that of the tool motion. Shaping of slot profiles was carried out to investigate the influences of depth of cut, rake angle and relief angle on the copying characteristic. The depth of slot was larger than the tool displacement in the Z-direction by 0.1-0.4 μm when the rake angle was -5 degrees and the relief angle was 12 degrees.
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    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Efficiency and Wear Behavior of the Abrasive Flow Machining Processing

    A Cheng WangChun Ho LiuYan Cherng LinShiuan Hau Pai...
    P.126-130页
    查看更多>>摘要：This study attempts to determine how AFM affects the polishing of complex hole to achieve a smooth surface by examining WEDM efficiency when cutting a complex hole for various degrees of surface roughness. This research showed the complex holes with the chain shape of the mold steel were cut by WEDM first, however, there were three kinds of the average roughness in the hole surface (1.3μm Ra, 0.8μm Ra and 0.4μm Ra) when three cutting processes of WEDM were used to manufacture the complex holes. Then silicon carbon (SiC) or diamond abrasive (DA) mixed with the silicone gel was utilized as abrasive medium to polish these holes, machining processes were finished when the surface roughness of the complex holes were decreased to the steady values in AFM. Finally, three surface roughness of the complex hole in the different positions would be used to judge the finishing surface was smooth or not, and machining time of the complex holes between WEDM and AFM was utilized to evaluate the efficiencies of these process when the surface of the complex holes had uniform roughness after machining. The results showed that surface roughness would not easily uniform after AFM until the cutting roughness, produced by WEDM, reduced to 0.4μm Ra when SiC was utilized as abrasive. But the surface roughness would uniform after AFM only the cutting roughness reached 0.8μm Ra when DA was used as abrasive, and the total machined time to a uniform roughness (WEDM+AFM) was the less (45 minutes) when the cutting roughness with 0.8μm Ra was utilized as original surface roughness.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Development and Test of CVD-Diamond Microgrinding Wheels

    HOFFMEISTER Hans-WernerWITTMER Ronald
    P.131-135页
    查看更多>>摘要：CVD-diamond microgrinding wheels can be used in the microsystems technology, e.g. to produce microarrays consisting of glass. These novel tools have the same advantages as CVD-diamond microgrinding pins, but they can even be used with higher cutting velocities and higher material removal rates. Furthermore, micro cracks and chipping could be minimized and better surface qualities could be achieved.The tool body consists of cemented carbide. After designing a suitable geometry for these novel micro grinding tools, they had to be produced with cup wheels. The design, which has already been tested, is a grinding wheel of the type "1A1". The CVD-diamond microgrinding wheels were analyzed with a scanning electron microscope (SEM) due to their topography and crystallite size.The microgrinding wheels were tested with regard to their grinding behavior. During the investigations, cutting forces were measured and afterwards analyzed. In addition, surface roughnesses were measured, so that the materials could be compared with regard to their grindability.The tool wear was evaluated by means of SEM-pictures. They showed the wear resisting behavior of the CVD-diamond microgrinding wheels. Even after grinding a high material removal rate in the hard ceramic aluminum nitride, only a small clogging of the microgrinding wheel was monitored. The slight increase of the cutting force is another indicator for the clogging.It can be summarized that novel grinding tools could be successfully developed and tested with hard and brittle materials. During these tests, the cutting forces and surface roughnesses as well as wear behavior and end of tool life were determined and will be shown in this publication.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Analysis of Motion Trajectory and Dwell Time of Abrasive in Magnetorheological Finishing with Tiny-grinding Wheel Cluster

    Jingfu ChaiQiusheng YanJiabin LuLingye Kong...
    P.136-140页
    查看更多>>摘要：Based on the analysis of the machining process of magnetorheological finishing with the tiny-grinding wheel cluster, the motion model of abrasive in the tiny-grinding wheel cluster was proposed to describe the motion trajectory and the dwell time of abrasive relative to the surface of workpiece. Then, the experiment was applied to study the effects of the motion trajectory and the dwell time on surface quality and machining efficiency of the workpiece. According to the analysis, a method to improve surface quality and machining efficiency in MRF with the tiny-grinding wheel cluster was presented.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Polishing Mechanism of Glass Substrates with Its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries

    T. YamazakiT. k. DoiS. KurokawaS. lsayama...
    P.141-145页
    查看更多>>摘要：With an aim to reduce the consumption of cerium oxide (CeO_2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO_2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives.As a result, we have found Mn_2O_3 abrasives potential to replace disappearing CeO_2 for the polishing of glass substrates.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Advanced Lapping and Polishing Methods for Planarizing a Single-Crystal 4H-Sic Utilizing Fe Abrasive Particles

    Akihisa KubotaMasahiko YoshimuraTakashi WatayoYoshitaka Nakanishi...
    P.146-149页
    查看更多>>摘要：We have developed advanced lapping and polishing methods for silicon carbide (SiC) substrates using an Fe abrasive particles and hydrogen peroxide (H2O2) solution. In this method, a SiC surface is oxidized by hydroxyl radicals (OH*), which was generated by Fe catalyst reactions, and the oxide layer on the SiC is mechanically and/or chemically removed by Fe abrasive particles and solution [1-4]. In this study, we applied this planarization method for lapping and polishing SiC surface, in which catalytically generated hydroxyl radicals were utilized to oxidize the surface of a SiC wafer. The processed surfaces were observed by optical interferometric microscope, Nomarski differential interference contrast. These observations showed that surface roughness and flatness of a SiC substrate were markedly improved and scratch-free SiC surface was obtained. These results provide useful information for preparing a high-efficiency and high-accuracy SiC substrate.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd

    Methods for Prevention of Ignition during Machining of Magnesium Alloys

    Junzhan HouWei ZhouNing Zhao
    P.150-154页
    查看更多>>摘要：Magnesium alloys have been increasingly used in automotive and aerospace components and in portable microelectronic devices due to their "ultralightness" and high specific strength. Machining is an important method used to process magnesium alloys. The advantages of machining over other processing methods such as die casting include reduction in power consumption and excellent surface finish. However, the ignition of chips presents a dangerous problem during machining. This problem has attracted considerable research interests. Though coolants can be used effectively to prevent ignition, the pollution of environment and reclamation of chips can not be resolved easily. Therefore, one better approach is to control the machining parameters for minimizing ignition hazard of magnesium alloy chips during dry machining. A systematic study was conducted for a few different magnesium alloys (including AM50A and AZ91D) to understand effect of cutting parameters (cutting speed, feedrate and depth of cut) on ignition of chips during face milling. It is interesting to find that for any fixed cut depth ignition in the forms of sparks, flares or ring of fire occurs only in the moderate cutting speeds and feedrates and can thus be easily prevented by adopting either higher or lower cutting speeds or feedrates. Chips produced in different machining conditions were collected and their morphology was analyzed to understand mechanisms of ignition.
      原文链接:
    • NETL
    • NSTL
    • Trans Tech Publications Ltd